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  6. 3M™ Scotch-Weld™ Structural Void Filling Compound EC-3460 HT FST

3M™ Scotch-Weld™ Structural Void Filling Compound EC-3460 HT FST

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Extrudable through both cartridge and dispensing system

High compressive strength from -55oC to 175oC

Meets stand-alone FAR / JAR 25.853 and ABD 0032

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PDF (1) Copy 26Tech Data Sheet (PDF, 350KB)

Details

Highlights
  • Extrudable through both cartridge and dispensing system
  • High compressive strength from -55oC to 175oC
  • Meets stand-alone FAR / JAR 25.853 and ABD 0032
  • 101 percent solids and free of shrinkage
  • Cures to a rigid, solvent resistant material in one hour at 125°C or 175°C
  • Non-halogenated, no intentionally added antimony
  • 100% solids with no shrinkage

It is designed for use on honeycomb sandwich structures as edge close out, corner reinforcement, local reinforcement for mechanical fixation, or complex gap filling.

Specifications

Adhesive Type

Epoxy

Resources