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3M™ Scotch-Weld™ Structural Adhesive Film AF 3109

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Designed for 250°F (120°C) cure or 350°F (175°C)

Adhesive can be cured from 225°F (107°C) up to 350°F (175°C)

Excellent shop handling characteristics

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Tech Data Sheet (PDF, 209KB)Safety Data Sheet (PDF, 0B)

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Highlights

Designed for 250°F (120°C) cure or 350°F (175°C)
Adhesive can be cured from 225°F (107°C) up to 350°F (175°C)
Excellent shop handling characteristics
Excellent pre-bond humidity performance on composite substrates
High-fracture toughness and peel strength
Scotch-Weld AF 3109-2 can be used with 3M™ Scotch-Weld™ Structural Adhesive Primer EC-3960
Improved resistance to high moisture pre-cure conditions

A thermosetting, modified epoxy structural adhesive film designed for bonding applications requiring high shear and peel strength at 250°F (121°C)

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