3M™ Light-To-Heat-Conversion Release Coating

3M ID B00042821

Enables stress free, room temperature debonding of adhesive to glass carrier interface with laser irradiation

Compatible with typical semiconductor chemistries and processes

Compatible with the 3M™ Wafer Support System

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Frequently viewed resources

Tech Data Sheet (PDF, 70KB)

Required products

3M(TM) Wafer De-Taping Tape 3305 and 879

Required to Use

3M™ Polyester Delaminating Tape 3305

3M(TM) UV-Curable Adhesive LC-3200, LC-4200 and LC-5200

Required to Use

3M™ UV-Curable Adhesive LC-3200

Details

Highlights

Enables stress free, room temperature debonding of adhesive to glass carrier interface with laser irradiation
Compatible with typical semiconductor chemistries and processes
Compatible with the 3M™ Wafer Support System
Applied using spin coating methods

3M™ Light-To-Heat-Conversion Release Coating (LTHC) ink is a solvent based coating applied using a spin coating method. This coating forms the light to heat conversion layer on a glass substrate for 3M™ Wafer Support System.

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3M™ Light-To-Heat-Conversion Release Coating

Frequently viewed resources

Required products

Required to Use

Required to Use

Details

Highlights

Resources

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