.050″ Boardmount Receptacle, Through-hole, Right Angle, Shielded, Diecast Body
Applications | Connection Stability, EMI Shielding, High-density Mounting, Repetitive Mating & Unmating |
Connector Style | Receptacle |
Contact Base Material | Copper Alloy |
Contact Underplating Material | Nickel |
Contact Underplating Thickness (Imperial) | 100 μin |
Contact Underplating Thickness (Metric) | 2.54 μm |
Current Rating | 1.0 |
Features | PCB Retention |
Insulation Material | Glass Reinforced Polyester (PCT) |
Markings | 3M Logo and Part Number |
Mating Contact Finish Material | Gold |
Mating Contact Finish Thickness (Imperial) | 30 μin |
Mating Contact Finish Thickness (Metric) | 0.76 μm |
Maximum Operating Temperature (Celsius) | 105 ℃ |
Maximum Operating Temperature (Fahrenheit) | 221 ℉ |
Minimum Operating Temperature (Celsius) | -55 ℃ |
Minimum Operating Temperature (Fahrenheit) | -67 ℉ |
Mounting Type | Boardmount |
Number of Contact Rows | 2 |
Number of Contacts | 14 , 20 , 26 , 36 , 40 |
PCB Mounting Angle | Right Angle |
PCB Mounting Style | Through Hole |
Pitch (Imperial) | 0.05 in |
Pitch (Metric) | 1.27 mm |
Product Usage | Boardmount, Electronic Devices |
Shell Material | Steel |
Shell Plating | Nickel |
Specifications Met | China RoHS, RoHS 2011/65/EU, UL 94V-0 |
Tech Sheet Number | TS-0531 |
Termination Method | Solder |
Data Sheets
(PDF , 394KB)
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