Semiconductor Filtration

Chemical mechanical polishing (CMP) is a process to level uneven areas by combining a chemical (acidic or basic) slurry of micro-abrasives with mechanical force provided by polishing. In multilevel metallization processes, as each new metal layer gets added it magnifies the imperfections in the layer just below it. CMP allows for subsequent photolithography processes to take place with greater accuracy.

3M has the filtration solutions to control particle size in the slurries used in the CMP process to allow chipmakers to continue shrinking circuity needed in next generation devices.

Photolithography is a process used to pattern circuitry on a wafer. Removing unwanted organic contaminants, particles and ionic metal species from high purity chemicals supports the advancement of miniaturization of devices.

Filtration and purification products from 3M allow you to reduce contaminants to meet the needs of high-performance semiconductor manufacturing.

ElectroPlating solutions require both stringent particle and dissolved gas control to prevent defects and impurities in the deposited metal layer.

3M has both particle and and dissolved gas solutions to meet the needs for your electroplating process.

During wet processing, semiconductor devices are repeatedly dipped, immersed, or sprayed with solutions Even when cleaning steps are performed, the primary reason for device failure is contamination of the wafer surface. As device features continue to shrink, ensuring the purity of acids, bases, and solvents used in the manufacture process will remain critical.

From most acids and bases to alcohols and etchants, 3M has the filter for your chemical application.

Manufacturing semiconductors requires large amounts of chemicals, which invariably generates substantial volumes of wastewater. The many different fabrication processes create a variety of wastewater contaminants.

3M has filtration solutions designed to help you filter your wastewater to protect the environment and meet increasingly stringent discharge requirements.

3M™ Liqui-Cel™ Membrane Contactors are used in a variety of gas transfer applications to strip dissolved gases from aqueous fluids. In one specific use, ammonia gas is stripped from wastewater streams with a high concentration of ammonia, diffuses across the wall of a hollow fiber membrane, and is directly absorbed into a reactive acid solution.

This simultaneous removal and recovery of ammonia is possible in a single device. This process is called TMCS (Transmembrane Chemisorption).

3M™ Liqui-Cel™ Membrane Contactors provide efficient dissolved gas control in a compact design. Capable of adding gases to or removing dissolved gases and bubbles from compatible liquid streams, these gas transfer devices utilize hollow fiber membrane technology that help facilities around the world improve operating efficiency, performance and protect product quality.